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Epoxy Sealant

JR-Epoxy is a low-viscosity, single-component heat-curing epoxy structural adhesive with excellent bonding strength and temperature resistance. It provides strong adhesion to metals, ceramics, glass, plastics and wood, while offering efficient heat dissipation and resistance to mechanical and thermal shock.

Product Type	Epoxy Structural Adhesive
Solvent	Single-Component
Curing Temperature	Heat Curing
Application	High Strength & Temperature Resistance

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*Motor detailed config can be customized according to customer's requests, like voltage, speed, as well as shaft length and shape...

Description

Specifications

Advanced SMP Technology for Reliable Sealing Performance

JR-991 is a one-component moisture-curing sealant based on silane-modified polymer technology. It provides strong cohesive strength and reliable adhesion to metals, glass and various construction substrates.

Unlike conventional polyurethane sealants, JR-991 contains no isocyanates, solvents or silicone, offering a low-VOC and environmentally friendly sealing solution.

Why Choose Epoxy Sealant?

Strong Structural Bonding Performance

Provides excellent bonding strength for demanding applications requiring durable structural connections.

Wide Substrate Compatibility

Provides strong adhesion to metals including steel, aluminum and copper, as well as ceramics, glass, plastics and wood.

Excellent Temperature Resistance

Maintains reliable performance under heat-curing conditions and demanding thermal environments.

Thermal Management Capability

Provides efficient heat dissipation performance to support thermal control in electronic applications.

Mechanical & Thermal Shock Resistance

Offers resistance against mechanical and thermal shock, improving long-term durability in harsh environments.

Primer-Free Adhesion & Production Efficiency

Provides primer-less adhesion to most substrates and supports high-speed production lines requiring heat curing processes.

Applications

Electronic Component Encapsulation

Power Electronics Protection

Battery & Energy Component Bonding

Industrial Assembly & Precision Sealing

Need the Right Solution for Your Project?

Contact our technical team for product recommendations, samples, customization support and professional solutions tailored to your application requirements.

Item	Specification
Adhesive Type	Epoxy Structural Adhesive
Base Material	Epoxy Resin
Component	Single-Component
Viscosity	Low Viscosity
Curing Method	Heat Curing
Bonding Substrates	Metal, Ceramic, Glass, Plastic, Wood
Special Performance	Heat Resistance / Thermal Shock Resistance
Application Method	Industrial Dispensing

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